The principle of nitrogen generator applied in the electronics industry

The application principle of nitrogen generators in the electronics industry is mainly to separate high-purity nitrogen from air through pressure swing adsorption (PSA) or membrane separation technology. ‌

Working principle of nitrogen generator

Pressure swing adsorption (PSA) technology: The nitrogen generator utilizes the difference in adsorption rates of oxygen and nitrogen molecules on carbon molecular sieves to achieve oxygen nitrogen separation through periodic pressure changes. The specific process includes:

Pressure adsorption: Air is pressurized by a compressor and enters an adsorption tower containing carbon molecular sieves, where oxygen, carbon dioxide, and water vapor are adsorbed, while nitrogen passes through the adsorption tower.

Reduced pressure desorption: When the carbon molecular sieve in the adsorption tower is saturated with adsorption, impurities such as oxygen are desorbed through reduced pressure, and the carbon molecular sieve is regenerated.

Cyclic operation: Two adsorption towers alternate between adsorption and desorption processes to achieve continuous gas supply.

Membrane separation technology: The nitrogen generator separates oxygen and nitrogen through different permeation rates of polymer membranes. When compressed air passes through a membrane separator, oxygen molecules will pass through the membrane material faster due to their higher permeation rate, while nitrogen molecules will be relatively slower, thus achieving nitrogen enrichment on the other side of the membrane.

Applications in the electronics industry

In the electronic manufacturing industry, nitrogen is widely used in the production process of semiconductors, integrated circuits, and other products to prevent oxidation and improve product quality. Specific applications include:

Preventing oxidation: In the semiconductor manufacturing process, nitrogen serves as a protective gas to prevent the chip from reacting with oxygen during high-temperature processing, thereby ensuring the stability and reliability of the product.

Improving product quality: During the integrated circuit packaging process, nitrogen can provide an oxygen free environment, reduce oxidation and pollution, and ensure the smooth progress of the packaging process

Specification of nitrogen production device:

Nitrogen flow rate: 10-1000Nm ³/h (customized according to user requirements)

Nitrogen purity: 99~99.999%

Nitrogen pressure: 5-6 bar (pressure can be customized)

Control method: The equipment is controlled locally by PLC, and the main control room control is achieved through communication, which can achieve unmanned operation

Applicable environment: 5 ℃~37 ℃

Installation conditions: indoor, outdoor, frost resistant, load-bearing concrete floor, good ventilation